ASML Optics Lithography System TWINSCAN XT:400G

Description
The TWINSCAN XT:400G 365-nm Step-and-Scan system is an ultra high-productivity, dual-stage lithography tool designed for volume 300-mm wafer production at 350-nm resolution. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating overhead time and allowing for continuous patterning of wafers. In addition, a high-intensity 5.5-kW Hg lamp and fast stages ensure maximum productivity by minimizing the exposure scanning time per field and the stepping time between fields. The level sensor, in combination with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge die and ensures high yield across the entire 300-mm wafer. High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.
Description
The TWINSCAN XT:400G 365-nm Step-and-Scan system is an ultra high-productivity, dual-stage lithography tool designed for volume 300-mm wafer production at 350-nm resolution. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating overhead time and allowing for continuous patterning of wafers. In addition, a high-intensity 5.5-kW Hg lamp and fast stages ensure maximum productivity by minimizing the exposure scanning time per field and the stepping time between fields. The level sensor, in combination with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge die and ensures high yield across the entire 300-mm wafer. High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.

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Lithography System - TWINSCAN XT:400G - ASML Optics
Wilton, CT, USA
Lithography System
TWINSCAN XT:400G
Lithography System TWINSCAN XT:400G
The TWINSCAN XT:400G 365-nm Step-and-Scan system is an ultra high-productivity, dual-stage lithography tool designed for volume 300-mm wafer production at 350-nm resolution. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating overhead time and allowing for continuous patterning of wafers. In addition, a high-intensity 5.5-kW Hg lamp and fast stages ensure maximum productivity by minimizing the exposure scanning time per field and the stepping time between fields. The level sensor, in combination with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge die and ensures high yield across the entire 300-mm wafer. High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.

The TWINSCAN XT:400G 365-nm Step-and-Scan system is an ultra high-productivity, dual-stage lithography tool designed for volume 300-mm wafer production at 350-nm resolution. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating overhead time and allowing for continuous patterning of wafers.
In addition, a high-intensity 5.5-kW Hg lamp and fast stages ensure maximum productivity by minimizing the exposure scanning time per field and the stepping time between fields. The level sensor, in combination with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge die and ensures high yield across the entire 300-mm wafer.
High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.

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Technical Specifications

  ASML Optics
Product Category Lithography Equipment
Product Number TWINSCAN XT:400G
Product Name Lithography System
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