Hermetic Solutions Group Datasheets for Electronic Packages and Lids

Electronic Packages and Lids are used in the microelectronic and fiber optic industry. Packages and lids are used to enclose electronic chips and interface with circuit boards. They are typicaly customized to customer requirements.
Electronic Packages and Lids: Learn more

Product Name Notes
Lids with integrated windows, manufactured by the Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.
Solder seal lids, typically used to seal ceramic packages, combine the lid and an accurately aligned solder preform into a single unit. This type of assembly makes it easier to...
The Hermetic Solution Group leads the way in overcoming some of the challenges faced by medical implant designers. We developed a ceramic-to-metal joining technology to make medical components smaller without...
The Hermetic Solutions Group has extensive experience in manufacturing power packaging, including high thermal dissipation power packages and power transistor outline packages. We have the largest selection of open tooling,...
The Hermetic Solutions Group manufactures both custom and standard drop-in microwave packages for multiple industries including defense and aerospace. These components are used in higher-end applications, such as satellite, missiles,...
The Hermetic Solutions Group manufactures custom fiber optic and telecommunications packages for a variety of applications including: WADM modules Modulators Attenuators Pump lasers Switches Amplifiers This market has expanded to...
The Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform...
The Hermetic Solutions Group offers standard flatpack, plug-in and platform packages in all common industry configurations. Our In-house engineering & manufacturing capabilities enable the Hermetic Solutions Group to accommodate any...
The lid and the lidding process are often considered to be one of the least exciting aspects of hermetic microelectronic packaging. There are often many technical challenges in the design...
We know that our customers need options when designing hermetic packages to protect sensitive electronics. Our thermal titanium composite packaging technology with Cu/Mo heat sinks was developed to address the...
With over 70 years of experience and extensive manufacturing capability, the Hermetic Solutions Group has the largest selection of open tooling, plus custom capabilities for any size package, including JEDEC...