Suntech Advanced Ceramics (Shenzhen) Co., Ltd Datasheets for Semiconductor Wire and Wedge Bonders

Semiconductor wire and wedge bonders include tools for die bonding and wire bonding. Theyare used to attach and interconnect a semiconductor die or IC chip to a package or substrate. Die bonding tools include bonding capillaries, bonding wedges, EFO wands, die attach collets, die shear tools, ejector pins or push up needles, flip chip tools, spanking tools, push-up needles (pepperpots) and tab tools (microBGA, waffle).


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Product Name Notes
High quality and long life quality assurance, Suntech provide standard and custom parts for internationally renowned companies ASM, Hesse, Cho-Onpa, F&K Delvotec Bondtechnik, Palomar Technologies, DIAS Automation, West-Bond, Hybond, TPT,...
Superior electrode material assures the lifespan of EFO wand and consistent shape and size of free air ball. The tip of EFO wands are made of by Iridium, platinum &...