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Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels Low Viscosity, Non-Yellowing Two Component Epoxy One Component Low Viscosity, Optically Clear UV Curable One Component, Storage Stable Epoxy Resin Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels Low Viscosity, Non-Yellowing Two Component Epoxy One Component Low Viscosity, Optically Clear UV Curable One Component, Storage Stable Epoxy Resin Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye
Part Number EP41S-5 EP112LS UV19 EP19HTLV LED405FL3
Supplier Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc.
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer Ceramic, Glass; Composites; Metal; Porous Surfaces Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
Cure / Technology Room Temperature Vulcanizing or Curing; Thermoset Thermoset Thermoset; UV or Radiation Cured Thermoset Cures by LED light
Insulating Varnishes and Impregnating Resins from Master Bond, Inc.

Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5

Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5 -- View Larger Image
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5-Image

Specifications

Product Category
Insulating Varnishes and Impregnating Resins
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
Form / Shape
Liquid
Chemical System
Epoxy
Cure / Technology
Room Temperature Vulcanizing or Curing; Thermoset
Industry
Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Photonics; Semiconductors, IC's
Composition
 
Features
 
Use Temperature
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity
 
Gap Fill