Resin bond diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses.
The friability or breakdown of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action.
Resin bond mesh diamond is typically 40µm and larger in particle size and is available in standard electroless nickel (Ni) coatings of 30% and 56% by weight, and a copper (Cu) coating of 50% by weight. Electroless coated particles promote enhanced grinding wheel performance in terms of longevity due to improved heat removal from the grinding zone and increased abrasive adhesion in the bond system.