Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action.
Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.