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ASAI-YGNN-06-0320-0320xx-XYZT Planar Platform
This platform, Metis, is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters. This platform is currently used in:
Wafer Process Control applications such as Critical Dimension and Thin film Metrology.
Wafer Laser Thermal Annealing
It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application.
This platform features:
Flatness of motion given by the air bearing
Unlimited rotation in Theta
Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement
Buit-in gravity compensator in Z (patent pending)
Yaw correction can be done by slightly shifting the Y1 and Y2 motors
Can be further integrated with an Active Isolation System fully controlled by ETEL
Travels in X and Y can be made longer with some limitations on the performance
Total stroke: 320 mm for XY x 12 mm for Z
Speed: 1.2 m/s for XY, 0.1 m/s for Z and 15.7 rad/s for T
Acceleration: 1.2 g for XY, 0.2 g for Z and 104.7 rad/s2 for T
Position stability: ±25 nm for XY, ±15 nm for Z and ±0.2 arcsec for T
Bidirectional repeatability: ±0.4 µm for XY, ±0.3 µm for Z and ±2 arcsec for T