Leveling and Filling Compounds from Sauereisen, Inc.

Filler Compound -- No. 209FS

 
 
Filler Compound -- No. 209FS -- View Larger Image
Filler Compound -- No. 209FS-Image

Specifications

Product Category
Leveling and Filling Compounds
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  
Type / Form
Liquid; Powder
Substrate Compatibility
 
Industry
 
Use Temperature
 
Tensile (Break)