Thermon, Inc Datasheets for Electrical and Electronic Resins

Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more

Product Name Notes
Flexible Heat Transfer Compound -- EFS-1 EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon’s heat transfer compounds provide an efficient thermal connection between...
Heat Transfer Compound -- NH Nonhardening NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon’s heat transfer compounds provide an efficient thermal connection between...
SnapTrace® Heat Transfer Compound -- ST-1
SnapTrace® Heat Transfer Compound -- ST-2
SnapTrace® Heat Transfer Compound -- ST-3
SnapTrace® Heat Transfer Compound -- ST-4
SnapTrace® Heat Transfer Compound -- ST-5
SnapTrace® Heat Transfer Compound -- ST-6
SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation on straight piping runs 1-1/2 inches (38 mm) and larger. Thermon’s heat transfer compounds provide an efficient...
T-3 Heat Transfer Compound -- TFK-4
T-3 Heat Transfer Compound -- TFK-6
T-3 Heat Transfer Compound -- TFK-7
T-3 Heat Transfer Compound -- TFK-8
T-3 Heat Transfer Compound -- TFK-9
T-3 heat transfer compound creates an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single “Thermonized ™”steam tracer utilizing Thermon’s heat transfer compound...
Heat Transfer Compound -- TFK-4 SS
Heat Transfer Compound -- TFK-6
Heat Transfer Compound -- TFK-7 SS
Heat Transfer Compound -- TFK-8 SS
Heat Transfer Compound -- TFK-9 SS
T-99 is a specialty heat transfer compound formulated to provide exceptional thermal stability and superior bonding strength up to 1832°F (1000°C). Maximum exposure temperature 1832°F (1000°C)