Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.


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Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K. No silicone outgassing. No silicone extraction. Reduced tack on one side to aid in application assembly. Electrically isolating
Dimensions = 100 x 100mm
Thickness = 0.02in
Length = 100mm
Width = 100mm
Thermal Conductivity = 0.9W/m·K
Material = Polymer
Self-Adhesive = Yes
Minimum Operating Temperature = -60°C
Maximum Operating Temperature = +125°C
Hardness = Shore OO 40


Bergquist Company (The)
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Thermal Compounds and Thermal Interface Materials
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Use Temperature
Thermal Conductivity
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