Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.
1127229
Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components
Thermal Conductivity = 0.9W/m·K
Material = Non-Silicone
Maximum Operating Temperature = +130°C
Minimum Operating Temperature = -50°C
Operating Temperature Range = -50 - +130 °C
Specifications
Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Grease, Paste
