Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.

3629654


 
 
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The HI-FLOW flexible replaces thermal grease. Flexible substrate on aluminium with thermal conduction properties equivalent to those of thermal grease without its drawbacks during production. HI-FLOW 625 provides excellent thermal contact between 2 surfaces and insulation up to 4,000 V. Products available in dry version (DRY terminals or terminals with one face coated with thermal acrylic adhesive for easy positioning (AC terminals)
Dimensions = 19.05 x 12.7mm
Thickness = 0.127mm
Thermal Conductivity = 0.5W/m·K
Material = Hi-Flow 625
Self-Adhesive = Yes
Minimum Operating Temperature = -30°C
Maximum Operating Temperature = +150°C
Material Trade Name = Hi-Flow 625
Operating Temperature Range = -30 - +150 °C



Manufacturer
Bergquist Company (The)
Manufacturer Part Number
HF625-0.005-AC-54
Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Pad

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Material Properties (Nominal / Typical)
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Thermal Conductivity
 

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