Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.

446475


 
 
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446475-Image

T-pli 200 Seriesâ„¢ is the premium gap filler. Its unique blend of boron nitride and silicone produces Laird Technologies highest performing interface pad.The exceptional combination of high thermal conductivity and compliancy generates unmatched thermal resistances in a gap filling interface material. T-pli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. It is electrically insulating, stable from -45°C to 200°C, and meets UL 94HB rating.
Thermal performance leader . Thermal conductivity 6.0 W/mK. Soft and compliant. Square package outline. Breakdown voltage > 6 Vac. Operating temperature - 45 â†' 200ºC
Dimensions = 101.6 x 101.6mm
Thickness = 1.016mm
Length = 101.6mm
Width = 101.6mm
Thermal Conductivity = 6W/m·K
Material = Boron Nitride Filled Silicone Elastomer
Minimum Operating Temperature = -45°C
Maximum Operating Temperature = +200°C
Hardness = Shore OO 70
Operating Temperature Range = -45 - +200 °C


Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Pad
Use Temperature
 
Thermal Conductivity
 
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