Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.


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T-flex 600 Seriesâ„¢ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boron nitride filler in the composition. While extremely soft, T-flex 600 recovers to more than 90% of its original thickness after compression under low pressure. It is naturally tacky and requires no additional adhesive coating that could inhibit thermal performance. It is electrically insulating, stable from -45°C to 200°C and meets UL 94V0 rating.
Very high compressibility for low stress applications . Naturally tacky. Square package outline. Thermal conductivity 3.0 W/mK. Breakdown voltage > 5,000 Vac. Operating temperature -40 â†' 160°C
Dimensions = 101.6 x 101.6mm
Thickness = 4.064mm
Length = 101.6mm
Width = 101.6mm
Thermal Conductivity = 3W/m·K
Material = Boron Nitride Filled Silicone Elastomer
Self-Adhesive = Yes
Minimum Operating Temperature = -45°C
Maximum Operating Temperature = +200°C
Hardness = Shore OO 25

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Thermal Compounds and Thermal Interface Materials
Form / Shape

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Material Properties (Nominal / Typical)
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Thermal Conductivity

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