Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.

1130455


 
 
1130455 -- View Larger Image
1130455-Image

Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components
Thermal Conductivity = 0.9W/m·K
Material = Non-Silicone
Maximum Operating Temperature = +130°C
Minimum Operating Temperature = -50°C
Operating Temperature Range = -50 - +130 °C


Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Grease, Paste
Use Temperature
 
Thermal Conductivity
 
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