Thermal Compounds and Thermal Interface Materials from RS Components, Ltd.

127035


 
 
127035 -- View Larger Image
127035-Image

Thermally compound intended for use as thermal interface between processors and heatsink.
High thermal performance : 0.32°C/W ( TO220 termal test @ 50 psi). Density (g/cc) : 2.1. The compound requires pressure of assembly to cause flow
Thermal Conductivity = 1.5W/m·K
Material = Non-Silicone
Maximum Operating Temperature = +150°C
Operating Temperature Range = Maximum of +150 °C


Specifications

Manufacturer
Bergquist Company (The)
Manufacturer Part Number
TIC100A-00-00-5.0CC
Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Grease, Paste
Use Temperature
 
Thermal Conductivity
 
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