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Thermal Interface Materials Thermal - Pads, Sheets Two Component, Nickel Conductive Epoxy Adhesive Thermal Pad, Silicone, 150X1Mm, Blue Rohs Compliant Multicomp Pro High Thermal Conductive Gap Filler
Thermal Interface Materials Thermal - Pads, Sheets Two Component, Nickel Conductive Epoxy Adhesive Thermal Pad, Silicone, 150X1Mm, Blue Rohs Compliant Multicomp Pro High Thermal Conductive Gap Filler
Part Number BERGQUIST GAP PAD TGP A2000 BER337-ND EP21TDCN 41AH5837 T-top81
Supplier Henkel Corporation - Industrial Digi-Key Electronics Master Bond, Inc. Newark, An Avnet Company Shiu Li Technology Co., Ltd
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP A2000

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Thermal Interface Materials -- BERGQUIST GAP PAD TGP A2000-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
Form / Shape
 
Use Temperature
 
Thermal Conductivity