Thermal Interface Materials -- BERGQUIST GAP PAD TGP EMI1000
BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating.
Options and Configurations
Standard sheet size - 8" x 16" or custom configuration
Standard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
Custom made configurations available upon request
Benefits
- Thermal Conductivity: 1.0 W/m-K
- Electromagnetic Interference (EMI) absorbing
- Highly conformable, low hardness
- Fiberglass reinforced for puncture, shear and tear resistance
- Electrically isolating
