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Thermal Interface Materials Thermal - Pads, Sheets Thermally Conductive, USP Class VI approved Epoxy Adhesive Thermal Conductive Gel Pad
Thermal Interface Materials Thermal - Pads, Sheets Thermally Conductive, USP Class VI approved Epoxy Adhesive Thermal Conductive Gel Pad
Part Number BERGQUIST GAP PAD TGP EMI1000 1168-TG-A4500F-160-160-0.8-ND EP21AOLV-2Med 7123949 PK700
Supplier Henkel Corporation - Industrial Digi-Key Electronics Master Bond, Inc. RS Components, Ltd. Shiu Li Technology Co., Ltd
Form / Shape Gap Filler, Foam in Place Gasket Pad; Gap Filler, Foam in Place Gasket Gap Filler, Foam in Place Gasket Pad Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
Thermal Conductivity (W/m-K) 1 4 1.3 to 1.44 1000 7
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP EMI1000

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Thermal Interface Materials -- BERGQUIST GAP PAD TGP EMI1000-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Gap Filler, Foam in Place Gasket
Use Temperature
 
Thermal Conductivity
 
Dielectric Constant