Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 1000
BERGQUIST GAP FILLER TGF 1000, Thermally conductive vibration dampening, Two-component, Liquid, Gap Filling Material
BERGQUIST® GAP FILLER TGF 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a balance of cured material properties highlighted by low modulus and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink.
Options and Configurations
Spacer Beads - No spacer beads, 0.007" spacer beads
Pot Life - 15 min
Cartridges - 50cc, 400cc
Kits - 1200cc, 10 gallon
Custom made configurations available upon request
Benefits
- Thermal conductivity: 1.0 W/m-K
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% Solids – no cure by-products
- Excellent low and high temperature mechanical and chemical stability
