Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 2000
BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material
BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch. BERGQUIST GAP FILLER TGF 2000 is intended for use in thermal interface applications when a strong structural bond is not required.
Options and Configurations
Spacer Beads - No spacer beads, 0.007" spacer beads
Pot Life - 15 min, 60 min, 600 min
Cartridges - 50cc, 400cc
Kits - 1200cc, 10 gallon
Custom made configurations available upon request
Benefits
- Thermal conductivity: 2.0 W/m-K
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% Solids – no cure by-products
- Excellent low and high temperature mechanical and chemical stability
