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Thermal Interface Materials Highly Thermal Conductive, Electricity Insulative, Low Viscosity type Silicone Compound Thermal - Pads, Sheets Gap Filler 1500 50Cc Cartridge; Insulator Body Material Bergquist
Thermal Interface Materials Highly Thermal Conductive, Electricity Insulative, Low Viscosity type Silicone Compound Thermal - Pads, Sheets Gap Filler 1500 50Cc Cartridge; Insulator Body Material Bergquist
Part Number BERGQUIST GAP PAD TGP HC1000 SARCON ® SPG-50A 1168-TG-A1450-15-15-2.0-ND 92T0425 1359346
Supplier Henkel Corporation - Industrial Fujipoly® America Corp. Digi-Key Electronics Newark, An Avnet Company RS Components, Ltd.
Thermal Conductivity (W/m-K) 0.1000 5 14.5 1.8 400
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP HC1000

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Thermal Interface Materials -- BERGQUIST GAP PAD TGP HC1000-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
Form / Shape
 
Use Temperature
 
Thermal Conductivity