BERGQUIST GAP PAD TGP 3004SF, High Performance, Thermally Conductive Material With Silicone-Free, Polymer Pad BERGQUIST® GAP PAD TGP 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST GAP PAD TGP 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive. BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on the other side.

• Thermal Conductivity: 3.0 W/m-K
• Silicone-free formulation
• 0.25 mil PET provides easy disassembly, leaving no residue
• Tacky side allows for ease of handling and placement