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Thermal Interface Materials Thermal - Pads, Sheets Thermal Interface Material Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion Thermal Pad, Silicone, 150X3Mm, Blue Rohs Compliant Multicomp Pro
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Part Number BERGQUIST GAP PAD TGP 1500R 1168-2091-ND EP42HT-3AO 41AH5835
Supplier Henkel Corporation - Industrial Digi-Key Electronics Boyd Corporation Master Bond, Inc. Newark, An Avnet Company
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP 1500R

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Thermal Interface Materials -- BERGQUIST GAP PAD TGP 1500R-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
Form / Shape
 
Use Temperature
 
Thermal Conductivity