Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 1500R
BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material BERGQUIST® GAP PAD TGP 1500R has the same highly conformable, low-modulus polymer as the standard GAP PAD TGP 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.
- Thermal Conductivity: 1.5 W/m-K
- Fiberglass reinforced for puncture, shear and tear resistance
- Easy release construction
- Electrically isolating
Specifications
Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
