BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap filling material. This material has an extremely low viscosity to enable self-leveling and filling of voids resulting in excellent thermal transfer. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. As cured, BERGQUIST GAP FILLER TGF 1400SL provides a soft, thermally conductive, form-in-place elastomer that is ideal for fragile assemblies and filling unique and intricate gaps. BERGQUIST GAP FILLER TGF 1400SL exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.

• Thermal Conductivity: 1.4 W/m-K
• Self-Leveling
• Very Soft
• Vibration Dampening
• Low viscosity