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Thermal Interface Materials Thermal - Pads, Sheets One component, high temperature resistant epoxy system for bonding and sealing Pads, Thermocouple, 13X18Mm, Pk20; Thickness Labfacility
Thermal Interface Materials Thermal - Pads, Sheets One component, high temperature resistant epoxy system for bonding and sealing Pads, Thermocouple, 13X18Mm, Pk20; Thickness Labfacility
Part Number BERGQUIST GAP FILLER TGF 1000SR 1168-TG-A2200-25-25-1.5-ND EP17HTDA-1 72C1980 446582
Supplier Henkel Corporation - Industrial Digi-Key Electronics Master Bond, Inc. Newark, An Avnet Company RS Components, Ltd.
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 1000SR

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Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 1000SR-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
Form / Shape
 
Use Temperature
 
Thermal Conductivity