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Thermal Interface Materials Thermal - Pads, Sheets Non-Drip, Polysulfide Based Two Component Adhesive Thermal Joint Compound, Jar, 8Oz; Dispensing Method Wakefield Solutions
Thermal Interface Materials Thermal - Pads, Sheets Non-Drip, Polysulfide Based Two Component Adhesive Thermal Joint Compound, Jar, 8Oz; Dispensing Method Wakefield Solutions
Part Number BERGQUIST GAP PAD TGP 2000SF 1168-TG-APC93-10-10-1.0-0-ND EP21TPND-NV 00Z1247 9156060
Supplier Henkel Corporation - Industrial Digi-Key Electronics Master Bond, Inc. Newark, An Avnet Company RS Components, Ltd.
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP 2000SF

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Thermal Interface Materials -- BERGQUIST GAP PAD TGP 2000SF-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
Form / Shape
 
Use Temperature
 
Thermal Conductivity