Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 1000VOUSB




BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
- Thermal conductivity: 1.0 W/m-K
- Highly conformable, low hardness
- "Gel-like" modulus
- Decreased strain
- Puncture, shear and tear resistant
- Electrically isolating
Specifications
Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone