Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 1500
BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
- Thermal conductivity: 1.5 W/m-K
- Un-reinforced construction for additional compliancy
- Conformable, low hardness
- Electrically isolating
Specifications
Product Category
Thermal Compounds and Thermal Interface Materials
Chemical System
Silicone
