BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow

• Thermal impedance: 0.07ºC-in2 /W @ 25 psi
• Hi-Flow® coating will resist dripping
• Thermally conductive 55°C phase change compound
• Available in roll form with kiss-cut parts