BERGQUIST GAP PAD TGP 2000, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
BERGQUIST GAP PAD TGP 2000 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.
Options and Configurations
Standard sheet size - 8" x 16" or custom configuration
Standard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
Custom made configurations available upon request
- Thermal conductivity: 2.0 W/mK
- Low "S-Class" thermal resistance at very low pressures
- Highly conformable, low hardness
- Designed for low stress applications
- Fiberglass reinforced for puncture, shear and tear resistance