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Thermal Interface Materials Thermal - Pads, Sheets High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance Transistor Insulator; Insulator Body Material Keystone
Thermal Interface Materials Thermal - Pads, Sheets High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance Transistor Insulator; Insulator Body Material Keystone
Part Number BERGQUIST GAP PAD TGP 2000 1168-2199-ND EP110F8-3 97H7353 7524887
Supplier Henkel Corporation - Industrial Digi-Key Electronics Master Bond, Inc. Newark, An Avnet Company RS Components, Ltd.
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP 2000

Thermal Interface Materials -- BERGQUIST GAP PAD TGP 2000 -- View Larger Image
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 2000-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Gap Filler, Foam in Place Gasket
Use Temperature
 
Thermal Conductivity
 
Dielectric Constant