Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial
Thermal Gap Fillers -- BERGQUIST GAP FILLER TGF 3010APS
BERGQUIST GAP FILLER TGF 3010APS, a 2 part, 3.0 W/m-K, Silicone Free Gap Filler with High Dispense Rate.
BERGQUIST® GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution critical to power storage applications using lithium ion batteries. This material is an exceptional choice for use in auto and consumer applications.
- Thermal Conductivity: 3.0 W/m-K
- Dispensable liquid, 2K Silicone free Gap Filler
- Room temperature cure - no oven required
- Extremely high dispense rate: >40 cc/sec
- Low compression stress during assembly
Specifications
Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Gap Filler, Foam in Place Gasket
