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Thermal Interface Materials Thermal - Pads, Sheets Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird Complex Thermal Conductive Material
Thermal Interface Materials Thermal - Pads, Sheets Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird Complex Thermal Conductive Material
Part Number BERGQUIST GAP FILLER TGF 1100SF 1168-2033-ND 52Y0853 7226842 TR332CU
Supplier Henkel Corporation - Industrial Digi-Key Electronics Newark, An Avnet Company RS Components, Ltd. Shiu Li Technology Co., Ltd
Thermal Conductivity (W/m-K) 1.1 1.5 1.1 0.3700 1500
Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 1100SF

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Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 1100SF-Image

Specifications

Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Gap Filler, Foam in Place Gasket
Thermal Conductivity
 
Dielectric Constant