Thermal Compounds and Thermal Interface Materials from Henkel Corporation - Industrial
Thermal Interface Materials -- BERGQUIST GAP FILLER TGF 1100SF
BERGQUIST GAP FILLER TGF 1100SF, Thermally Conductive, Silicone-Free, Two-part, Low Modulus, Liquid Gap Filling Material
BERGQUIST® GAP FILLER TGF 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component, curing at room or elevated temperatures. The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications.
Options and Configurations
Spacer Beads - No spacer beads, 0.007" spacer beads
Pot Life - 240 min
Cartridges - 50cc, 400cc
Kits - 1200cc, 10 gallon
Custom made configurations available upon request
Benefits
- Thermal Conductivity: 1.1 W/m-k
- No silicone outgassing or extraction
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% solids – no cure by-products
Specifications
Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Gap Filler, Foam in Place Gasket
