Thermal Compounds and Thermal Interface Materials from Digi-Key Electronics
Thermal - Pads, Sheets -- 1944-1326-ND
CHO-THERM T500 TO-220 0.010" ADH
Specifications
Manufacturer
Parker Hannifin / Seal / O-Ring & Engineered Seals Division
Manufacturer Part Number
60-12-8302-T500
Product Category
Thermal Compounds and Thermal Interface Materials
Form / Shape
Pad
Thermal Conductivity
2.1 W/m-K (1.21 BTU-ft/hr-ft²-F)
More Information
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