Smiths Interconnect Datasheets for IC Sockets and Headers
IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
IC Sockets and Headers: Learn more
Product Name | Notes |
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5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action... | |
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World... | |
Features & Benefits Patented, low profile contact Solderless memory replacement Short signal path Conformal to recessed LGAs High speed signal integrity Electrically transparent contact High frequency bandwidth > 40GHz Low... | |
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT... | |
Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput. Features & Benefits Gutenberg sockets address requirements of the... | |
IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test. Higher speed digital and analog devices are being manufactured at record volumes and the need... | |
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with... | |
The next generation of high-performance semiconductors—from advanced Consumer SoCs and GPUs to AI Accelerators and Data Center processors demands unprecedented bandwidth and speed. Yet as data rates climb, ensuring signal... | |
The rapid expansion of connected devices and data-intensive applications are driving the growing demand for highly efficient and adaptive high-performance computing solutions. Whether it’s a complex SoC for a mobile... |