Allied Electronics, Inc. Datasheets for IC Sockets and Headers
IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
IC Sockets and Headers: Learn more
| Product Name | Notes |
|---|---|
| An improved, simpler, less costly method of semiconductor mounting. Avoid soldering directly to the semiconductor. Easier to service, economical, more efficient. Semiconductor not included. Materials: Socket Base: Phenolic, XP Grade. | |
| Easily assembles onto printed circuit board. Eliminates wiring. Stops on PC terminals provide sufficient spacing between socket and PC board to permit proper assembly of transistor to socket. Can be... | |
| Features an all-in-one mounting plate and solder tabs, providing complete electrical isolation of the solder tab connections. Choice of single or dual collector solder tabs. Rated 5 amps DC continuous... | |
| Pre-assembling the socket to the chassis by eyelets or rivets permits the installation of the semi conductor at a later stage in the assembly. The molded top boss eliminates hardware. | |
| Socket and transistor are assembled to chassis at same time, using the minimum amount of hardware. Top molded boss ensure the transistor leads will be isolated from the chassis. Various... | |
| Socket is installed onto chassis using eyelets or screws. Transistor is installed afterwards. Assembly and repairs are simplified since socket will stay in place without transistor mounted. Top molded boss... | |
| Various molded boss heights. The socket is held underneath the chassis and the semiconductor is inserted into the contacts of the socket holding the assembly in position. To complete the... | |
| Contact Features Closed-End Construction Eliminating Any Solder or Flux Wicking Problems Breakaway Feature for Breaking Strips into Any Desired Shorter Lengths (No Special Tooling Required) Withstands Most Severe Environmental Conditions... | |
| Precision Four-Finger Inner Contact Provides Concentric Funnel Entry for Easy Flat and Round Lead Insertion BeCu Inner Contact for Maximum Mechanical and Electrical Performance PC Board Thickness Range: 0.062" and... | |
| Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs... | |
| 0.020 in. Lead Wire Diameter, Microphone Sockets Series 917 TO package sockets Two 8 pin versions feature pin centers on 0.200 in. or 0.230 in. circle Series 388 microphone socket... | |
| 132 Positions, Tube Packaging Type, 0.025 in. Centerline, Black, Sockets 0.025 centerline for high density, low cost packaging. Low profile permits even higher density packaging with only 0.375 maximum height... | |
| 16 Pins, Slotted Contact Style, 0.300 in. Row to Row Spacing, Plug Adapter Assembly This series is a high quality machine pin molded adapter which is used to assemble hybrid... | |
| 3 Number of Pins, 0.016 in. Lead Size Accepted Diameter, Brass Sleeve, Socket These transistor sockets utilize hi-rel machined outer sleeves and gold-plated inner contacts assembled into a low profile... | |
| AMP DIP Socket, Beryllium Copper Contact Material, 0.100 " Centerline, 0.120 " Terminal Post Length Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability... | |
| AMP DIP Socket, Beryllium Copper Contact Material, 0.100 " Centerline, 0.125 " Terminal Post Length Precision Four-Finger Inner Contact Provides Concentric Funnel Entry for Easy Flat and Round Lead Insertion | |
| connector,dip socket,open frame,screw machine cont,.125 tail,6 position | |
| connector,plcc socket,thru hole mounting,lead free,44 position | |
| DIP IC Socket, 14 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability... | |
| DIP IC Socket, 18 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability... | |
| DIP IC Socket, 20 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability... | |
| Dip Socket, 16 Position, .300 Centerline, Thru-Hole | |
| DIP Socket, 40 Pos., Vertical PCB Mount, Ladder Frame Style, 2.54mm (.100 in) CL | |
| DIP Socket, 6 Position, Vertical Mount,Thru-Hole, .100 CL, Closed Frame | |
| DIP Socket, 8 Position, Vertical Mount,Ladder Frame, .100 CL, Thru-Hole | |
| DIP Socket, Thru Hole Mounting Type Thru hole mounting type The contact material is beryllium copper. | |
| DIP Sockets, Phosphor Bronze Contact Material, +105°C Operating Temperature Thru hole mounting type Wave solder capable to 240°C Glass-filled thermoplastic housing material Solder Tail Dual Leaf (DL) Sockets Dual Wiping... | |
| Dual In Line Socket, 3 Level Wrapost Open Frame, Gold Contact Mating Area Plating Solderless wrapost terminals are firmly locked in the insulator body to withstand torque of wrapping (No... | |
| Dual In Line Socket, Long Solder Tail for Multilayer PC-Boards, Open Frame DIP sockets with increased solder tail, allowing application on multilayer PCBs up to .139 " (No Suggestions), 4-finger... | |
| Dual In Line Socket, Solder Tail, Closed Frame, 3 A Current Rating Closed frame insulator withstands high mechanical impact. Low (No Suggestions), 4-finger #30 clip | |
| Dual In Line Socket, Standard Solder Tail Open Frame All DIP sockets accept 0.015 to 0.025” Dia. and standard IC (No Suggestions), 4-finger BeCu #30 clip rated at 3 A... | |
| IC SOCKET, DIP, SOLDER, 28 CONTACTS | |
| IC Socket, SIP; Screw Machine; Standard; 20; Beryllium Copper; Gold; 0.125 in. | |
| IC Socket, Solder Tail with Open Frame Gold over nickel contact DIP socket, solder tail open frame, gold over nickel plating contact. | |
| IC Socket, Wrapost Tail with Open Frame Gold over nickel contact DIP socket, wrapost tail 3 lever open frame, gold over nickel plating contact. | |
| IC Socket; 28; 0.05 in.; Phosphor Bronze; Tin over Nickel | |
| IC Socket; 28; 0.1 in.; Phosphor Bronze; Tin-Lead; 30; 1 A; PPS; Thru-Hole | |
| IC Socket; 32; 0.1 in.; Phosphor Bronze; Tin over Nickel (ROHS) | |
| IC Socket; 44 position 0.1 in.; Phosphor Bronze; Tin over Nickel | |
| IC Socket; 44; 0.05 in.; Phosphor Bronze; Tin over Nickel | |
| IC Socket; 52; 0.1 in.; Phosphor Bronze; Tin over Nickel | |
| IC Socket; 84; 0.1 in.; Phosphor Bronze; Tin Lead Over Nickel; Thermoplastic | |
| IC Socket; 84; 0.1 in.; Phosphor Bronze; Tin over Nickel | |
| Longer Solder Tail Open Frame DIP Sockets, Beryllium Copper Contact Material | |
| Open Frame DIP Sockets With Integral Decoupling Capacitor, 3 A Current Rating | |
| Pin Grid Array Socket, 0.020 in. Dia. Pin, 0.125 in. Length Sockets solder tail length is standard, long and low profile Choice of three low force clips to cover all... | |
| PLCC Chip Carrier Socket (Surface Mount) 44 position | |
| PLCC Socket, 68 Pos., 2.54mm (.100 inch) CL, Normal Insertion Force, Thru-Hole | |
| Single-In-Line Sockets, Beryllium Copper Contact Material 20 positions The contact plating is gold. | |
| SIP Socket, Thermoplastic Polyester Housing, Beryllium Copper Contact Material, 20 Positions Contact Features Closed-End Construction Eliminating Any Solder or Flux Wicking Problems Breakaway Feature for Breaking Strips into Any Desired... | |
| SOCKET, DIP, OPEN, THRU-HOLE, HIGH TEMPINSULATOR, ULTRA LOW PROFILE, 16 PIN | |
| SOCKET, DIP, OPEN, THRU-HOLE, HIGH TEMPINSULATOR, ULTRA LOW PROFILE, 8 PIN | |
| SOCKET, DIP, OPEN, THRU-HOLE, HIGH TEMPINSULATOR, VERY LOW PROFILE, 14 PIN | |
| SOCKET, DIP, OPEN, THRU-HOLE, HIGH TEMPINSULATOR, VERY LOW PROFILE, 18 PIN | |
| Socket, DIP;14Pins;500 Series Machined Contact;Closed;0.3In .;Beryllium Copper | |
| Socket, DIP;14Pins;Dual Leaf;Closed;Solder Tail;0.31In.;Phospho r Bronze;Gold | |
| Socket, DIP;14Pins;Dual Leaf;Economy Ladder;0.3In.;Phosph or Bronze;Tin/Lead | |
| Socket, DIP;16Pins;Dual Leaf;Economy Ladder;0.3In.;Phosph or Bronze;Tin/Lead | |
| Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Berylli um Copper;Gold (15) | |
| Socket, DIP;24Pins;Dual Leaf;Economy Ladder;0.3In.;Phosph or Bronze;Tin/Lead | |
| Socket, DIP;28Pins;Dual Leaf;Economy Ladder;0.3In.;Phosph or Bronze | |
| Socket, DIP;28Pins;Dual Leaf;Economy Ladder;0.6In.;Phosph or Bronze | |
| Socket, DIP;6Pins;Dual Leaf;Economy Ladder;0.3In.;Phosph or Bronze;Tin/Lead | |
| Socket, DIP;8Pins;Dual Leaf;Closed;Solder Tail;0.31In.;Phospho r Bronze;Gold | |
| Socket, DIP;Dual Leaf;14 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Ber. Copper;Gold | |
| Socket, DIP;Dual Leaf;14 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Phosph or Bronze | |
| Socket, DIP;Dual Leaf;16 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Ber. Copper;Gold | |
| Socket, DIP;Dual Leaf;18 Pos.;0.100In.cen.;Th ru Hole;0.300In.;Phosph or Bronze | |
| Socket, DIP;Dual Leaf;20 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Phosph or Bronze | |
| Socket, DIP;Dual Leaf;6 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Phosph or Bronze | |
| Socket, DIP;Dual Leaf;8 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Ber. Copper;Gold | |
| Socket, DIP;Dual Leaf;8 Pos.;0.100In.cen.;Th ru Hole;0.310In.;Phosph or Bronze | |
| Socket, DIP;Open;4-Finger;8 Pos. | |
| Socket, PLCC, PCS Series, 44 Position, .100 inch Centerline, Square, Thru-Hole | |
| Socket, PLCC; 32 Positions; 0.100in | |
| Socket, PLCC; 44 Positions; 0.100;Phosphor Bronze; Tin Lead over Nickel | |
| Socket, PLCC; 52 Positions; 0.100 in.; Phosphor Bronze; Tin Lead over Nickel | |
| Socket; 0.025 in.; Black; 132; 0.375 in | |
| Socket; 0.025 in.; Black; 132 | |
| Sockets, DIP, Economy Ladder Style,.300Centerline , 20 position | |
| Solder Tail Closed Frame DIP Sockets, 3 A Current Rating | |
| Standard Solder Tail Open Frame DIP Sockets, Beryllium Copper Contact Material | |
| STRIP SOCKET 3 PIN SOLDER TAIL | |
| Transistor Socket, Brass Sleeve, Printed Circuit Terminal, Teflon Insulator These transistor sockets utilize hi-rel machined outer sleeves and gold-plated inner contacts assembled into a low profile insulator. The funnel entry... | |
| Transistor Socket; 3 Pins; 0.125"" Length, Terminal Post | |
| ZIP DIP II Socket 28 position (.100 lead spacing) |