3M Aerospace and Aircraft Maintenance Division 3M™ Scotch-Weld™ Structural Splice Adhesive Film AF 3090

3M,Ñ¢ Scotch-Weld,Ñ¢ Structural Splice Adhesive Film AF 3090 TEF is a thermal expandable adhesive film designed for bonding metal and composite materials. It cures at temperatures ranging from 250¬8F (120¬8C) to 350¬8F (180¬8C) and exhibits excellent bond properties, impact resistance, and peel strength. The film expands during curing, allowing it to fill gaps and mismatched surfaces effectively, making it suitable for core-splicing and edge-finishing applications in sandwich structures. The adhesive film is available in two thicknesses: 50 mil and 100 mil, with a non-sag formulation that ensures ease of application. It has a service temperature range of -67¬8F to 350¬8F and offers a shelf life of up to 12 months when stored properly. Surface preparation is critical for optimal performance, requiring clean, dry, and grease-free surfaces.