3M Thermally Conductive Tape; Thermal Conductivity 3M 9890 (1"X36YDS)

Description
THERMALLY CONDUCTIVE TAPE; Thermal Conductivity:0.6W/m. K; Conductive Material:Polymer; Thickness:0.127mm; Thermal Impedance:-; Dielectric Strength:-; External Length:32.918mm; External Width:25.4mm; Product Range:9890 Series RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE TAPE; Thermal Conductivity:0.6W/m. K; Conductive Material:Polymer; Thickness:0.127mm; Thermal Impedance:-; Dielectric Strength:-; External Length:32.918mm; External Width:25.4mm; Product Range:9890 Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Tape; Thermal Conductivity 3M - 41T5552 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Tape; Thermal Conductivity 3M
41T5552
Thermally Conductive Tape; Thermal Conductivity 3M 41T5552
THERMALLY CONDUCTIVE TAPE; Thermal Conductivity:0.6W/m. K; Conductive Material:Polymer; Thickness:0.127mm; Thermal Impedance:-; Dielectric Strength:-; External Length:32.918mm; External Width:25.4mm; Product Range:9890 Series RoHS Compliant: Yes

THERMALLY CONDUCTIVE TAPE; Thermal Conductivity:0.6W/m.K; Conductive Material:Polymer; Thickness:0.127mm; Thermal Impedance:-; Dielectric Strength:-; External Length:32.918mm; External Width:25.4mm; Product Range:9890 Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5552
Product Name Thermally Conductive Tape; Thermal Conductivity 3M
Thermal Conductivity 0.6000 W/m-K (0.3467 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Customized high quality phase change TIMs - SP205A-60 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -40 to 257 F (-40 to 125 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Highly Thermally Conductive and Non-Flammable Interface Material - SARCON ® XR-Pe - Fujipoly® America Corp.
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.0787 inch (1 to 2 mm)
View Details