3M 3M Dynatron 694 Filler - Amber Liquid 1 gal Can - 00694 70008003405

Description
3M Dynatron 694 amber filler is compatible with aluminum, concrete, fiberglass, metal, stainless steel and wood materials with a 2 hr cure time.
Description
3M Dynatron 694 amber filler is compatible with aluminum, concrete, fiberglass, metal, stainless steel and wood materials with a 2 hr cure time.

Suppliers

Company
Product
Description
Supplier Links
3M Dynatron 694 Filler - Amber Liquid 1 gal Can - 00694 - 076308-00694 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M Dynatron 694 Filler - Amber Liquid 1 gal Can - 00694
076308-00694
3M Dynatron 694 Filler - Amber Liquid 1 gal Can - 00694 076308-00694
3M Dynatron 694 amber filler is compatible with aluminum, concrete, fiberglass, metal, stainless steel and wood materials with a 2 hr cure time.

3M Dynatron 694 amber filler is compatible with aluminum, concrete, fiberglass, metal, stainless steel and wood materials with a 2 hr cure time.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Sealants
Product Number 076308-00694
Product Name 3M Dynatron 694 Filler - Amber Liquid 1 gal Can - 00694
Type / Form Liquid
Unlock Full Specs
to access all available technical data

Similar Products

Epoxylite® - E 8121 Hi Temp Epoxy Kit - ELANTAS North America LLC
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Dissimilar Substrates
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Potting Compounds - 1810369 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Chemical System Epoxy
Features Encapsulant, Potting Compound
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details