3M 3M 3792 LM Q Hot Melt Adhesive Clear 0.625 in x 8 in Stick, 11 lb Case 7000000880

Description
3M Hot Melt Adhesive 3792 LM Q Clear, formerly known as Jet-Melt, is a 100% solid, thermoplastic resin that is used for bonding wood, polyolefins, coated paper, and heat sensitive materials. furniture, corrugated, and lightweight materials. For use with low melt applicator only. 0.625 in x 8 in Stick.
Request a Quote Datasheet
Description
3M Hot Melt Adhesive 3792 LM Q Clear, formerly known as Jet-Melt, is a 100% solid, thermoplastic resin that is used for bonding wood, polyolefins, coated paper, and heat sensitive materials. furniture, corrugated, and lightweight materials. For use with low melt applicator only. 0.625 in x 8 in Stick.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
3M 3792 LM Q Hot Melt Adhesive Clear 0.625 in x 8 in Stick, 11 lb Case - 3792LM Q - Ellsworth Adhesives
Germantown, WI, USA
3M 3792 LM Q Hot Melt Adhesive Clear 0.625 in x 8 in Stick, 11 lb Case
3792LM Q
3M 3792 LM Q Hot Melt Adhesive Clear 0.625 in x 8 in Stick, 11 lb Case 3792LM Q
3M Hot Melt Adhesive 3792 LM Q Clear, formerly known as Jet-Melt, is a 100% solid, thermoplastic resin that is used for bonding wood, polyolefins, coated paper, and heat sensitive materials. furniture, corrugated, and lightweight materials. For use with low melt applicator only. 0.625 in x 8 in Stick.

3M Hot Melt Adhesive 3792 LM Q Clear, formerly known as Jet-Melt, is a 100% solid, thermoplastic resin that is used for bonding wood, polyolefins, coated paper, and heat sensitive materials. furniture, corrugated, and lightweight materials. For use with low melt applicator only. 0.625 in x 8 in Stick.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 3792LM Q
Product Name 3M 3792 LM Q Hot Melt Adhesive Clear 0.625 in x 8 in Stick, 11 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
UV-Curing Epoxy, NOA 1375, 6 gm Syringe - NOA-1375S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 181 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Composition Filled
Industry Electronics; Semiconductors, IC's
View Details
Soft thermal conductive silicone pad, suitable for AI data centers, CPU and GPU - SF100 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details