3M 3M 2262 Plastic Adhesive Clear 1 qt Can 7000000818

Description
3M Plastic Adhesive 2262 Clear, formerly known as Scotch-Grip, is a fast bonding, synthetic resin that is used for bonding vinyl. It is high strength, non-staining, short bonding ranges, and resistant to plasticizer migration. 1 qt Can.
Request a Quote Datasheet
Description
3M Plastic Adhesive 2262 Clear, formerly known as Scotch-Grip, is a fast bonding, synthetic resin that is used for bonding vinyl. It is high strength, non-staining, short bonding ranges, and resistant to plasticizer migration. 1 qt Can.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
3M 2262 Plastic Adhesive Clear 1 qt Can - 2262 1 QUART - Ellsworth Adhesives
Germantown, WI, USA
3M 2262 Plastic Adhesive Clear 1 qt Can
2262 1 QUART
3M 2262 Plastic Adhesive Clear 1 qt Can 2262 1 QUART
3M Plastic Adhesive 2262 Clear, formerly known as Scotch-Grip, is a fast bonding, synthetic resin that is used for bonding vinyl. It is high strength, non-staining, short bonding ranges, and resistant to plasticizer migration. 1 qt Can.

3M Plastic Adhesive 2262 Clear, formerly known as Scotch-Grip, is a fast bonding, synthetic resin that is used for bonding vinyl. It is high strength, non-staining, short bonding ranges, and resistant to plasticizer migration. 1 qt Can.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 2262 1 QUART
Product Name 3M 2262 Plastic Adhesive Clear 1 qt Can
Cure / Technology Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
UV-Curing Epoxy, NOA 1375, 6 gm Syringe - NOA-1375S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 611 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Type / Form Sheet or Film
Industry Electronics; Semiconductors, IC's
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details