3M 3M Scotch-Weld TL71 Threadlocker - Red Liquid 1.69 fl oz Bottle - 62613 62349650606

Description
3M Scotch-Weld TL71 red threadlocker is compatible with metal materials with a 24 hr cure time. Delivers great performance with tensile strength of 180 to 410 psi. Minimum to maximum operating temperatures are -65 F to +300 F.
Description
3M Scotch-Weld TL71 red threadlocker is compatible with metal materials with a 24 hr cure time. Delivers great performance with tensile strength of 180 to 410 psi. Minimum to maximum operating temperatures are -65 F to +300 F.

Suppliers

Company
Product
Description
Supplier Links
3M Scotch-Weld TL71 Threadlocker - Red Liquid 1.69 fl oz Bottle - 62613 - 048011-62613 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M Scotch-Weld TL71 Threadlocker - Red Liquid 1.69 fl oz Bottle - 62613
048011-62613
3M Scotch-Weld TL71 Threadlocker - Red Liquid 1.69 fl oz Bottle - 62613 048011-62613
3M Scotch-Weld TL71 red threadlocker is compatible with metal materials with a 24 hr cure time. Delivers great performance with tensile strength of 180 to 410 psi. Minimum to maximum operating temperatures are -65 F to +300 F.

3M Scotch-Weld TL71 red threadlocker is compatible with metal materials with a 24 hr cure time. Delivers great performance with tensile strength of 180 to 410 psi. Minimum to maximum operating temperatures are -65 F to +300 F.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Adhesives
Product Number 048011-62613
Product Name 3M Scotch-Weld TL71 Threadlocker - Red Liquid 1.69 fl oz Bottle - 62613
Type / Form Liquid
Unlock Full Specs
to access all available technical data

Similar Products

UV-Curing Epoxy, NOA 85, 6 gm Syringe - NOA-85S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Features Flame Retardant; Thermally Conductive; UL Rating
View Details
Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details