3M 3M 05815 Filler - Red Paste 1 qt Can - 05815 60980022655

Description
3M 05815 red filler is compatible with fabric and fiberglass materials. Provides a 3 to 5 min working time.
Description
3M 05815 red filler is compatible with fabric and fiberglass materials. Provides a 3 to 5 min working time.

Suppliers

Company
Product
Description
Supplier Links
3M 05815 Filler - Red Paste 1 qt Can - 05815 - 051131-05815 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M 05815 Filler - Red Paste 1 qt Can - 05815
051131-05815
3M 05815 Filler - Red Paste 1 qt Can - 05815 051131-05815
3M 05815 red filler is compatible with fabric and fiberglass materials. Provides a 3 to 5 min working time.

3M 05815 red filler is compatible with fabric and fiberglass materials. Provides a 3 to 5 min working time.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Sealants
Product Number 051131-05815
Product Name 3M 05815 Filler - Red Paste 1 qt Can - 05815
Type / Form Grease, Paste
Unlock Full Specs
to access all available technical data

Similar Products

Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy - EP40TC - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Type / Form Liquid
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit - E 813-9 HI TEMP 100GM KIT - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Features Encapsulant, Potting Compound
View Details