3M 5595 Thermal Pad 210Mm X 300Mm 2Mm Sheet; Thickness 3M 5595

Description
5595 THERMAL PAD 210MM X 300MM 2MM SHEET; Thickness:2mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:300mm; External Width:210mm; RoHS Compliant: Yes
Datasheet
Description
5595 THERMAL PAD 210MM X 300MM 2MM SHEET; Thickness:2mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:300mm; External Width:210mm; RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
5595 Thermal Pad 210Mm X 300Mm 2Mm Sheet; Thickness 3M - 78T6284 - Newark, An Avnet Company
Chicago, IL, United States
5595 Thermal Pad 210Mm X 300Mm 2Mm Sheet; Thickness 3M
78T6284
5595 Thermal Pad 210Mm X 300Mm 2Mm Sheet; Thickness 3M 78T6284
5595 THERMAL PAD 210MM X 300MM 2MM SHEET; Thickness:2mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:300mm; External Width:210mm; RoHS Compliant: Yes

5595 THERMAL PAD 210MM X 300MM 2MM SHEET; Thickness:2mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m.K; Thermal Impedance:-; Volume Resistivity:10ohm-cm; External Length:300mm; External Width:210mm; RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 78T6284
Product Name 5595 Thermal Pad 210Mm X 300Mm 2Mm Sheet; Thickness 3M
Thermal Conductivity 1.6 W/m-K (0.9245 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High-Performance Carbon Fiber Thermal Conductive Pad for Mass Storage Devices - CSF20 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details