3M Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M 5595 1.0MM

Description
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M - 72Y1350 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M
72Y1350
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M 72Y1350
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes

THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m.K; Thermal Impedance:-; Volume Resistivity:10ohm-cm; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 72Y1350
Product Name Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M
Thermal Conductivity 1.6 W/m-K (0.9245 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Thermal conductive gel pad for mobile phone smartphone - SF400 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Highly Conformable and Non-Flammable, Higher Thermal interface material - SARCON® PG80B - Fujipoly® America Corp.
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details