3M Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M 5595 1.0MM

Description
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M - 72Y1350 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M
72Y1350
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M 72Y1350
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes

THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m.K; Thermal Impedance:-; Volume Resistivity:10ohm-cm; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 72Y1350
Product Name Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M
Thermal Conductivity 1.6 W/m-K (0.9245 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Two-Part Thermal Gap Filler - SARCON® LG23A and LG30A - Fujipoly® America Corp.
Specs
Type High Dielectric
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Gel; Gap Filler, Foam in Place Gasket
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details