3M Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M 5595 1.0MM

  • Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M - 72Y1350 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M - 72Y1350 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M
72Y1350
Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M 72Y1350
THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m. K; Thermal Impedance:-; Volume Resistivity:10ohm-cm ; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes

THERMAL PAD 105Mm x 150MM SHEET; Thickness:1mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m.K; Thermal Impedance:-; Volume Resistivity:10ohm-cm; External Length:150mm; External Width:105mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 72Y1350
Product Name Thermal Pad 105Mm X 150Mm Sheet; Thickness 3M
Thermal Conductivity 1.6 W/m-K (0.9245 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life - EP21ND-LP - Master Bond, Inc.
Master Bond, Inc.
Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life
EP21ND-LP
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Grease, Paste
View Details
Thin Flim, High Thermal Conductivity with 0.05mm Glass Cloth Reinforcement - SARCON ® GHR - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Flim, High Thermal Conductivity with 0.05mm Glass Cloth Reinforcement
SARCON ® GHR
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0059 to 0.0118 inch (0.1500 to 0.3000 mm)
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed
SE3000
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Thermally Conductive - 3319A55 - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive
3319A55
Specs
Cure / Technology Two Component  
Form / Shape 5 gal - part A
Chemical System Epoxy
View Details