3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5592-10

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5544 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5544
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5544
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m.K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5544
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 1.1 W/m-K (0.6356 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Double-component thermal conductive sealant gel for heat transfer - SE300AB - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Thin Film, General Purpose - SARCON ® TR - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details