3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5592-10

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5544 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5544
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5544
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m.K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5544
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 1.1 W/m-K (0.6356 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Electrolube ® ER2188 General Purpose Epoxy Compound -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details
Double-component thermal conductive sealant gel for heat transfer - SE300AB - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications - MasterSil 323AO-LO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details