3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5591S-15

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5540 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5540
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5540
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5540
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 1 W/m-K (0.5778 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Electrolube ® ER2188 General Purpose Epoxy Compound -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details