3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5591S-10

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes
  • Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5539 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5539 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5539
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5539
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1W/m.K; Breakdown Voltage Vbr:200V; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:5.5kV/mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5539
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 1 W/m-K (0.5778 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Pedigree®
40 VTC-40F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Silicone Free Form-in-Place Thermal Gap Filler - SARCON® SPG-25B-NS - Fujipoly® America Corp.
Fujipoly® America Corp.
Silicone Free Form-in-Place Thermal Gap Filler
SARCON® SPG-25B-NS
Specs
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Industry Electronics
Use Temperature -40 to 248 F (-40 to 120 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details