3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5519S-15

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm
  • Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5534 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5534 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5534
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5534
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m.K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-cm; Thermal Impedance:-; Dielectric Strength:3.1kV/mm

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5534
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 4.9 W/m-K (2.83 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Pedigree®
40 VTC-40F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Carbon Fiber Thermal Gap Fillers - CF210A - Fujipoly® America Corp.
Fujipoly® America Corp.
Carbon Fiber Thermal Gap Fillers
CF210A
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Use Temperature -40 to 302 F (-40 to 150 C)
View Details
Thermal Pads - 9092045 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
9092045
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details