3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5519S-15

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm
  • Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5534 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5534 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5534
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5534
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m.K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:1.7ohm-cm; Thermal Impedance:-; Dielectric Strength:3.1kV/mm

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5534
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 4.9 W/m-K (2.83 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed
SE3000
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Thin Film, High Thermal Conductivity - SARCON ® HR - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Film, High Thermal Conductivity
SARCON ® HR
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting - EP88FL - Master Bond, Inc.
Master Bond, Inc.
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting
EP88FL
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket (optional feature)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details