3M Thermally Conductive Tape, 50.8Mm X 4.57M; Thermal Conductivity 3M 2/5/8810

Description
THERMALLY CONDUCTIVE TAPE, 50.8Mm x 4.57M; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.25mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:50.8mm RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE TAPE, 50.8Mm x 4.57M; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.25mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:50.8mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Tape, 50.8Mm X 4.57M; Thermal Conductivity 3M - 99Y6005 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Tape, 50.8Mm X 4.57M; Thermal Conductivity 3M
99Y6005
Thermally Conductive Tape, 50.8Mm X 4.57M; Thermal Conductivity 3M 99Y6005
THERMALLY CONDUCTIVE TAPE, 50.8Mm x 4.57M; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.25mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:50.8mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE TAPE, 50.8Mm x 4.57M; Thermal Conductivity:0.6W/m.K; Conductive Material:Acrylic Polymer; Thickness:0.25mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:50.8mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 99Y6005
Product Name Thermally Conductive Tape, 50.8Mm X 4.57M; Thermal Conductivity 3M
Thermal Conductivity 0.6000 W/m-K (0.3467 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Two Component Thermally Conductive Epoxy - EP21TDCAOHT - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details