3M Glue, Adhesives, Applicators 08115

Description
PANEL BONDING ADHESIVE, 08115, 2
  • Glue, Adhesives, Applicators - 08115-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
PANEL BONDING ADHESIVE, 08115, 2
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Glue, Adhesives, Applicators - 08115-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Glue, Adhesives, Applicators
08115-ND
Glue, Adhesives, Applicators 08115-ND
PANEL BONDING ADHESIVE, 08115, 2

PANEL BONDING ADHESIVE, 08115, 2

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Industrial Adhesives
Product Number 08115-ND
Product Name Glue, Adhesives, Applicators
Chemical System Epoxy
Unlock Full Specs
to access all available technical data

Similar Products

Epoxylite® - E 230 - C 230 - ELANTAS North America LLC
ELANTAS North America LLC
Epoxylite®
E 230 - C 230
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Unfilled
View Details
Adhesives - - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details
UV-Curing Epoxy, NOA 85, 6 gm Syringe - NOA-85S - Newport MKS
Newport MKS
UV-Curing Epoxy, NOA 85, 6 gm Syringe
NOA-85S
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Copper Adhesion Promoters for IC Substrates - MultiPrep 200 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Copper Adhesion Promoters for IC Substrates
MultiPrep 200
Specs
Type / Form Sheet or Film; Liquid
Substrate Compatibility Metal; Copper adhesion promotion
Industry Electronics; Semiconductors, IC's
View Details